- Interconnects Connectors USB connectors
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YMUVG30212
Description
NOTES:
1.0. MATERIALS:
1.1 CONTACT:PHOSPHORUS COPPER
PLATING : 10u" Au OVER 30u" Ni UNDERPLATED.
80u" Sn/Cu ON SOLDER TAIL AREA.
1.2 HOUSING:HI-TEMPERATURE,L.C.P
THERMOPLASTIC
1.3 SHELL MATERIAL: COPPER ALLEY 0.30±0.02.
FINISH:NIKEL.
2.0. ELECTRICAL:
2.1 Rating:AC 5V/0.5A
2.2 Contact Resistance:50m Ohm less
2.3 Insulation Resistance:100M Ohm Min at DC500V
2.4 Dielectric Withstanding Voltage:AC 100V for 1 minute(Cut-off:0.5mA)
3.0 MECHANICAL:
3.1 Insertion force:35N (3.57kgf) max.
3.2 Withdrawal Force: 1N (0.1kgf) min.
1.0. MATERIALS:
1.1 CONTACT:PHOSPHORUS COPPER
PLATING : 10u" Au OVER 30u" Ni UNDERPLATED.
80u" Sn/Cu ON SOLDER TAIL AREA.
1.2 HOUSING:HI-TEMPERATURE,L.C.P
THERMOPLASTIC
1.3 SHELL MATERIAL: COPPER ALLEY 0.30±0.02.
FINISH:NIKEL.
2.0. ELECTRICAL:
2.1 Rating:AC 5V/0.5A
2.2 Contact Resistance:50m Ohm less
2.3 Insulation Resistance:100M Ohm Min at DC500V
2.4 Dielectric Withstanding Voltage:AC 100V for 1 minute(Cut-off:0.5mA)
3.0 MECHANICAL:
3.1 Insertion force:35N (3.57kgf) max.
3.2 Withdrawal Force: 1N (0.1kgf) min.
Supplier Information
Yue Sheng Exact Industrial Co., Ltd
TEL : 886-2-26942256 FAX : 886-2-269474542f., No. 3, Alley 11, Lane 351, Fu-teh 1st Rd., Hsi-chih City, Taipei, Taiwan, R.o.c., 221
Web-Site : http://www.yue-sheng.com.tw/
E-Mail : h82567@ms41.hinet.net