- Interconnects Connectors Memory card connectors
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K461S01
MS Duo Adapter
Description
SPECIFICATION MATERIAL
◆ Insulator: Thermal Plastic UL94V-V2
◆ Contacts: Copper Alloy
CONTACT PLATING
◆ Underplate: 50m" Nickel
◆ Contact Area: 1m" ~ 30m" Selective Gold
◆ Solder Tails Area: 100m" Tin/Lead(Brighten Tin)or
100m" Tin/Lead Free(Brighten Tin/Matte Tin)
ELECTRICAL
◆ Operation Voltage: 3.3V
◆ Current Rating: 0.5 Amps Max.
◆ Contact Resistance: 80 mohms Max.
◆ Insulation Resistance: 1000 Mohms Min. @ 500 VDC
◆ Dielectric Withstanding Voltage: 250 VAC / Minute
◆ Operating Temperature: -20°C to +60°C
◆ Mating Cycles: 10,000 Insertions (In Office)
◆ Insulator: Thermal Plastic UL94V-V2
◆ Contacts: Copper Alloy
CONTACT PLATING
◆ Underplate: 50m" Nickel
◆ Contact Area: 1m" ~ 30m" Selective Gold
◆ Solder Tails Area: 100m" Tin/Lead(Brighten Tin)or
100m" Tin/Lead Free(Brighten Tin/Matte Tin)
ELECTRICAL
◆ Operation Voltage: 3.3V
◆ Current Rating: 0.5 Amps Max.
◆ Contact Resistance: 80 mohms Max.
◆ Insulation Resistance: 1000 Mohms Min. @ 500 VDC
◆ Dielectric Withstanding Voltage: 250 VAC / Minute
◆ Operating Temperature: -20°C to +60°C
◆ Mating Cycles: 10,000 Insertions (In Office)
Supplier Information
Kendu Technology Co., Ltd.
TEL : 886-2-2695-0505 FAX : 886-2-2692-65659F, No.236, Jung Hsing Rd., Hsi-chih Dist., New Taipei City, post code 22158, Taiwan
Web-Site : http://www.kendu.com.tw/
E-Mail : melody@kendu.com.tw