- Interconnects Connectors Wire To Board connectors
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LW-PA200R-XX-D
2.0mm Pitch Single Row Wafer , 90°DIP
Description
Specifications
- Current Rating: 3A AC/ DC (Max)AWG#22
- Voltage Rating: 250V AC/ DC
- Temperature Range: -25°C ~ + 85°C
- Contact Resistance: 20mΩ Max
- Insulation Resistance: 1000MΩ Min
- Withstand Voltage:800V AC/Minute
- Pin Material: Brass/ Tin-plated
- Wafer Material: Glass-filled PBT,UL94V-0,natural
Supplier Information
LAI HENG TECHNOLOGY LTD.
TEL : (02)8228-6487 FAX : (02)8228-6486新北市中和區建八路185號14樓
Web-Site : http://www.laiheng.com.tw/
E-Mail : joeho@aiheng.com.tw